Mems process power

ABSTRACT

A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second piezoelectric layer is a more compressive layer with an average stress that is less than or more compressive than an average stress of the first piezoelectric layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application which claimspriority to and the benefit of U.S. application Ser. No. 17/567,719entitled “MEMS PROCESS POWER,” filed on Jan. 3, 2022, which claimspriority to and the benefit of U.S. application Ser. No. 15/568,553entitled “MEMS PROCESS POWER,” filed on Apr. 22, 2016, now issued U.S.Pat. No. 11,217,741, issued on Jan. 4, 2022, which is a continuation of,and claims benefit under 35 U.S.C. 120 to international applicationPCT/US2016/028770, filed Apr. 22, 2016, which claims the benefit under35 U.S.C. 119(e) of U.S. Provisional Application No. 62/152,731 entitled“MEMS PROCESS POWER,” filed on Apr. 24, 2015, the contents of which areincorporated by reference in their entireties.

SUMMARY

A transducer includes a first piezoelectric layer; and a secondpiezoelectric layer that is above the first piezoelectric layer; whereinthe second piezoelectric layer is a more compressive layer with anaverage stress that is less than or more compressive than an averagestress of the first piezoelectric layer. In an example, the transducerincludes a stack of layers that comprise the first and secondpiezoelectric layers, wherein a third layer in the stack is between thefirst and second piezoelectric layers. The second piezoelectric layer isfabricated by adjusting a bias power to a level that produces a verticalstress that is less than or more compressive than a vertical stress ofthe first piezoelectric layer. A vertical stress of the secondpiezoelectric layer offsets a vertical stress of the first piezoelectriclayer to eliminate deflection in the acoustic transducer. The transducercomprises a MEMS transducer, an acoustic transducer, a piezoelectrictransducer or a microphone.

In some examples, a method includes depositing a first piezoelectriclayer on a substrate; depositing an intervening layer on the firstpiezoelectric layer; obtaining information indicative of a firstvertical stress of the first piezoelectric layer; determining a secondvertical stress that offsets the first vertical stress such that acombination of the first and second vertical stresses is a substantiallyzero deflection of the transducer; selecting a bias power that producesthe second vertical stress; and depositing, using the selected biaspower, the second piezoelectric layer on the intervening layer. Otherembodiments of this aspect include corresponding computer systems,apparatus, and computer programs recorded on one or more computerstorage devices, each configured to perform the actions of the methods.

In this example, deposition of the second piezoelectric layer uses theselected bias power throughout an entirety of deposition of the secondpiezoelectric layer. The actions include adjusting a bias power on adeposition tool to be the selected bias power. The intervening layer isa layer of molybdenum.

In another example, a transducer includes a first piezoelectric layer;and a second piezoelectric layer that is above the first piezoelectriclayer; wherein the second piezoelectric layer has an average stress thatcompensates for a non-uniform amount of stress through a thickness ofthe first piezoelectric layer such that the first and secondpiezoelectric layers lie substantially flat. In this example, the secondpiezoelectric layer compensates for the non-uniform amount of stress bybeing more compressive than the first piezoelectric layer, when thestress of the first piezoelectric layer becomes more tensile (increases)as the thickness of the first piezoelectric layer increases, or by beingmore tensile than the first piezoelectric layer, when the stress of thefirst piezoelectric layer becomes more compressive (decreases) as thethickness of the first piezoelectric layer increases. A compressivelayer is a layer that deflects downwards and wherein a tensile layer isa layer that deflects upwards.

In still another example, a system of one or more computers can beconfigured to perform particular operations or actions (e.g., describedabove) by virtue of having software, firmware, hardware, or acombination of them installed on the system that in operation causes orcause the system to perform the actions. One or more computer programscan be configured to perform particular operations or actions by virtueof including instructions that, when executed by data processingapparatus, cause the apparatus to perform the actions.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of a transducer device.

FIGS. 2-10 are plot diagrams.

FIG. 11 is a flowchart of a process for fabricating a transducer device.

DETAILED DESCRIPTION

A transducer device (e.g., a microphone) includes multiple (e.g., two)piezoelectric layers and the other layers are very thin. There arevarious types of transducer devices, e.g., acoustic transducer devices,microphones, energy harvesters, resonators, Microelectromechanicalsystems (MEMS) transducer devices, and so forth. In a MEMS transducer,two piezoelectric layers are used, e.g., to obtain twice the amount ofenergy that would be obtained from a non-MEMS transducer.

Referring to FIG. 1 , transducer device 100 is fabricated as cantilever101 or a plate. In this example, cantilever 101 includes a cantileveredbeam (hereinafter “beam”). Cantilever 101 includes various layers 102 a. . . 102 n of materials, with each layer including its own verticalstress (as shown in a vertical stress profile). In order to fabricate alevel (e.g., flat) cantilever that does not bend, the average stressesamong various layers 102 a . . . 102 n are balanced to achieve a flatdevice. Balancing of the stresses is facilitated by cantilever 101comprising different types of materials at various layers 102 a . . .102 n, such that the different materials have different stresses, whichcan be used to balance each other out.

In general, the curvature of a multi-layer cantilever is computed (e.g.,by a system) in accordance with the following equation:

$\kappa = {\frac{1}{EI}{\int\limits_{0}^{{\mathcal{z}}_{N}}{{{\sigma({\mathcal{z}})} \cdot \left( {{\mathcal{z}} - c} \right)}d{\mathcal{z}}}}}$

where κ (kappa) is curvature (e.g., second derivative of displacement),σ is the film residual stress (as a function of z), z is a distance froma bottom of cantilever 101. Each of layers 102 a . . . 102 n has anassociated height. For example, the height of layer 102 n is hN. In thisexample, cantilever 101 can be characterized in accordance with thefollowing equations:

${EI} = {\frac{b}{3}{\sum\limits_{i = 1}^{N}{E_{i}\left\lbrack {\left( {{\mathcal{z}}_{i} - c} \right)^{3} - \left( {{\mathcal{z}}_{i - 1} - c} \right)^{3}} \right\rbrack}}}$and$c = {\frac{1}{2}\frac{\overset{N}{\underset{i = 1}{}}{E_{i}\left( \begin{matrix}z_{i}^{2} & z_{i}^{2}\end{matrix}_{1} \right)}}{\overset{N}{\underset{i = 1}{}}{E_{i}\left( \begin{matrix}z_{i} & z_{i}\end{matrix}_{1} \right)}}}$

where Ei is the modulus of elasticity of layer i and b is the beamwidth. EI is the product of the Young's modulus (E) and the moment ofinertia (I), and c is the neutral axis, the z location at which adeflected plate does not get longer or shorter. σ is not a constant.Rather, σ is a function of z, i.e., σ(z). If the integral shown above

$\left( {{e.g.},{\int\limits_{0}^{{\mathcal{z}}_{N}}{{{\sigma({\mathcal{z}})} \cdot \left( {{\mathcal{z}} - c} \right)}{d\mathcal{z}}}}} \right)$

is equal to zero throughout the thickness of the multi-layer cantilever,the cantilever is going to be flat. Accordingly, the integral will havedifferent values for σ at the different layers. So, for the top AlNlayer, σ is used to adjust the offset, e.g., by adjusting the biaspower. That is, via adjustment of the bias power, the amount of verticalstress of the two piezoelectric layers offset each other for minimal orzero deflection. In this example, a “recipe” is determined for anappropriate bias power to provide a required offset, e.g., an offset atwhich the cantilever lies flat (e.g., as determined by visual inspectionor by application of the foregoing equations). As such, σ of the bottomAlN layer will have a different value from σ of the top AlN layer. So, σfor the top layer is adjusted (via the bias power) to make it morecompressive, so that when you integrate through z the cantilever haszero curvature.

In a MEMS device, two piezoelectric layers are used. Aluminum nitride(AlN) is one type of piezoelectric material used for a piezoelectriclayer. In some example, the AlN is doped aluminum nitride (AlN dopedwith scandium) to obtain AlN with higher sensitivity and output signal.In still other example, other materials could be used in fabricating abeam or transducer using the techniques described herein.

Aluminum nitride (AlN) becomes more tensile as it is deposited. If theaverage stress of two piezoelectric layers (e.g., two AlN layers) in astack (of layers that form the cantilever) are the same, a cantileverwill not be flat but will bend up.

To address this issue of curvature in MEMS devices, a deposition recipecan be adjusted in order to achieve a film that does not become moretensile as it gets thicker. For example, continual adjustment of gasflow rates throughout deposition can be used to eliminate a verticalstress profile of AlN. However, this continual adjustment technique maydegrade the crystalline structures of a deposition layer.

Another technique is to adjust the stress of the second layer to achieveflat plates. For example, the average stress of the second layer isfabricated to be about 245 MPa more compressive than the first, toachieve flat plates (e.g., layers) for the cantilever.

Referring to FIG. 2 , plot 200 includes curve 202 that expresses therelationship between stress and film thickness. In this example, as thethickness (of AlN) increases the stress increases, causing the layer tobecome more tensile as it gets thicker. As shown in plot 200, thevertical stress of a layer increases as the thickness increases.

In this example, the stress of the first piezoelectric layer becomesmore tensile (increases) as the thickness of the first piezoelectriclayer increases. In another example (not shown in FIG. 2 ), the stressof the first piezoelectric layer becomes more compressive (decreases) asthe thickness of the first piezoelectric layer increases. A cantileverhas multiple layers. However, in this case, the AlN layers constitutethe majority of the beam thickness and the AlN layers mainly contributeto deflection.

Referring to FIG. 3 , plot 300 includes curve 302 that expresses arelationship between residual stresses and beam thickness, e.g., fordifferent portions of the beam (e.g., cantilever 101).

In the example of FIG. 3 , the beam has a total thickness of 2micrometers (μm). The first 0-1 μm of the beam comprises a first AlNlayer and an average stress of 356 MPA. As shown in FIG. 3 , the amountof residual stress from 0-1 μm increases from approximately 0 MPa toalmost 500 MPa, with the increase forming a vertical stress gradient.The second AlN layer corresponds to the portion of the beam that has athickness of 1 μm to 2 μm and has the same residual stress profile andaverage stress as the first AlN layer.

Referring to FIG. 4 , plot 400 includes line 402 to graphicallyillustrate the above integral

$\left( {{e.g.},{\overset{{\mathcal{z}}_{N}}{\int\limits_{0}}{{{\sigma({\mathcal{z}})} \cdot \left( {{\mathcal{z}} - c} \right)}{d\mathcal{z}}}}} \right).$

In particular, line 402 represents a distance to the neutral axis, c, asa function of beam thickness.

Referring to FIG. 5 , plot 500 includes areas 501, 502, which representa total quantity under the integral, e.g., based on multiplying curve300 in FIG. 3 by line 400 in FIG. 4 . Area 502 represents that the totalarea under the integral is positive, in which case the curvature will bea positive number and the beam will bend up. Area 501 represents thatthe area under the integral is negative, in which case the curvaturewill be negative and the beam will bend down.

Referring to FIG. 6 , plot 600 includes curve 602 which expresses arelationship between beam deflection and beam length. In this example,the curvature is 363/m and the deflection of a 350 μm long cantileverbeam is shown by curve 602.

Because the AlN layers have the same stress profiles, the deflectionincreases across the length of the beam—as shown in FIG. 6 . If biaspowers are substantially (e.g., exactly) the same (e.g., because thesame recipe is being used) to deposit layers, then each piezoelectriclayer will have substantially the same stress.

In order to reduce the beam deflection, the average stress of the secondAlN layer can be reduced. In this example, the average stress of thesecond AlN layer has been reduced by 137 MPa. Referring to FIG. 7 , plot700 includes curve 702 that represents the stress profile of the twolayers. Referring to FIG. 8 , plot 800 includes areas 802, 804, whichrepresent the area under the integral. The adjusted stress profile nowprovides a curvature of −0.3/m, much closer to zero than the curvatureabove. Referring to FIG. 9 , plot 900 includes line 902, whichrepresents the relationship between beam length and beam deflection,e.g., of the beam in this example in which the average stress of thesecond AlN layer is reduced by 137 MPa.

In operation, a deposition tool deposits various layers on a substrateto fabricate the cantilever beam. The deposition tools allows for theadjustment of bias power. By adjusting the bias power, the verticalstress of the two piezoelectric layers offset each other for minimal orzero deflection, as shown in plots 700, 800, 900 of FIGS. 7-9 ,respectively.

Referring back to FIG. 7 , the first AlN layer (corresponding to theportion of the beam from approximately 0-1 μm and represented in plot700 as the beam thickness from 0-1 μm) has an amount of residual stressincreasing from approximately 0 MPa to almost 500 MPa. The second AlNlayer (corresponding to the portion of the beam from approximately 1-2μm and represented in plot 700 as the beam thickness from 1-2 μm) has anamount of residual stress increasing from approximately −100 MPa toalmost 400 to offset the amount of residual stress in the first AlNlayer. In this example, the second AlN layer is deposited with a biaspower that differs from the bias power used in depositing the first AlNlayer. The vertical stress of the second AlN layer offsets the verticalstress of the first AlN layer such that a combination of these verticalstresses is a substantially zero vertical deflection.

The difference between the average residual stress of the first layerand the average residual stress of the second layer produces an offsetthat reduces (or eliminates) deflection in the cantilever beam, causingthe beam to lie flat. If the second layer has an average stress that isless than or more negative than the average residual stress of the firstlayer, then an offset is formed that causes the cantilever to benddownward.

In particular, the top layer of AlN (e.g., the second layer) isfabricated to be a compressive layer to compensate for the verticalstress in both the bottom and top layers of AlN (e.g., the first layer)and any stress imparted by other layers in the cantilever beam (e.g.,such as molybdenum layers).

Generally, bias power includes a direct current (DC) deliberately madeto flow, or DC voltage deliberately applied, between two points (e.g.,between the chamber and the sputter target). A type of bias power isradio frequency (rf) power (e.g., rf bias power), which deposition toolsapply to wafers in fabricating the cantilevers. In using the depositiontool, a wafer is placed face down on a platen. Rf power (e.g., in therange of 30-300 W) is applied between the target and the wafer, creatinglow energy ion bombardment during film growth (e.g., growth of a film asa layer).

Referring to FIG. 10 , plot 1000 includes curve 1002 that represents therelationship between bias power and stress. Stress is a function of rfbias power. In this example, the stress is for 1000 nm thick AlN films.There is a defined relationship between stress and bias power, in whichstress decreases as bias power increases. So, to obtain a top AlN layerof a particular amount of vertical stress that is required to offset thevertical stress profile of the bottom AlN layer, a system consistentwith this disclosure determines the average stress of the top layer(needed to eliminate deflection) and adjusts the bias power to obtainthat average stress, in accordance with the defined relationship betweenbias power and stress.

In this example, the bias power affects sigma. An increase in the biaspower causes sigma to decrease. By increasing the bias power, theaverage stress in a layer is decreased. By decreasing the bias power,the average stress in a layer increases. Referring back to FIG. 7 , thebias power is used to shift the average amount of stress of the secondAlN layer to be lower, so decreasing the average stress—to make it morecompressive, more negative stress. In this example, the bias power is aninput on the sputter tool and bias power is not continuously adjustedduring deposition, to ensure quality and integrity of the depositedlayers. That is, adjustment of the bias during deposition (as opposed todetermining an amount of bias power to be applied to obtain acompressive layer), may reduce the structural quality of a layer. Filmstress can be adjusted in ways other than adjusting RF bias, such as byadjusting Ar or N2 gas flow rates.

Referring to FIG. 11 , a system (or a fabrication device) implementsprocess 1100 for fabricating a transducer. In operation, the systemdeposits (1102) a first piezoelectric layer on a substrate. The systemalso deposits (1104) an intervening layer on the first piezoelectriclayer. The system obtains (1106), e.g., from an external data repositoryor from execution of instructions for determining a vertical stress,information indicative of a first vertical stress of the firstpiezoelectric layer. The system determines (1108) a second verticalstress that offsets the first vertical stress such that a combination ofthe first and second vertical stresses is a substantially zerodeflection of the transducer. The system selects (1110) a bias powerthat produces the second vertical stress. The system deposits (1112),using the selected bias power, the second piezoelectric layer on theintervening layer. In this example, deposition of the secondpiezoelectric layer uses the selected bias power throughout an entiretyof deposition of the second piezoelectric layer. The system also adjustsa bias power on a deposition tool to be the selected bias power. In thisexample, the intervening layer is a layer of molybdenum.

The techniques described herein may be used to compensate for anon-uniform amount of stress through a thickness of the firstpiezoelectric layer, e.g., by making the second layer more compressiveor tensile. A non-uniform amount of stress causes deflection, whetherupwards or downwards. That is, the foregoing equations may be used todetermine and to adjust an initial (or original) curvature of layers andan entire cantilever, e.g., whether that initial curvature is positiveor negative. In this example, an acoustic transducer includes a firstpiezoelectric layer; and a second piezoelectric layer that is above thefirst piezoelectric layer; wherein the second piezoelectric layer has anaverage stress that compensates for a non-uniform amount of stressthrough a thickness of the first piezoelectric layer such that the firstand second piezoelectric layers lie substantially flat, e.g., by havingless than a threshold amount of curvature or deflection. The secondpiezoelectric layer compensates for the non-uniform amount of stress bybeing more compressive than the first piezoelectric layer, when thefirst piezoelectric layer is a tensile layer, or by being more tensilethan the first piezoelectric layer, when the first piezoelectric layeris a compressive layer. A compressive layer is a layer that deflectsdownwards and a tensile layer is a layer that deflects upwards.

The techniques describes herein may be used to fabricate a beam or aplate. In turn, an acoustic transducer or a transducer may be comprisedof one or a plurality of these beams/plates.

Embodiments can be implemented in digital electronic circuitry, or incomputer hardware, firmware, software, or in combinations thereof.Apparatus can be implemented in a computer program product tangiblyembodied or stored in a machine-readable storage device for execution bya programmable processor; and method actions can be performed by aprogrammable processor executing a program of instructions to performfunctions by operating on input data and generating output. Thetechniques described herein can be implemented advantageously in one ormore computer programs that are executable on a programmable systemincluding at least one programmable processor coupled to receive dataand instructions from, and to transmit data and instructions to, a datastorage system, at least one input device, and at least one outputdevice. Each computer program can be implemented in a high-levelprocedural or object oriented programming language, or in assembly ormachine language if desired; and in any case, the language can be acompiled or interpreted language.

Suitable processors include, by way of example, both general and specialpurpose microprocessors. Generally, a processor will receiveinstructions and data from a read-only memory and/or a random accessmemory. Generally, a computer will include one or more mass storagedevices for storing data files; such devices include magnetic disks,such as internal hard disks and removable disks; magneto-optical disks;and optical disks. Storage devices suitable for tangibly embodyingcomputer program instructions and data include all forms of non-volatilememory, including by way of example semiconductor memory devices, suchas EPROM, EEPROM, and flash memory devices; magnetic disks such asinternal hard disks and removable disks; magneto-optical disks; andCD_ROM disks. Any of the foregoing can be supplemented by, orincorporated in, ASICs (application-specific integrated circuits).

Other embodiments are within the scope and spirit of the description andthe claims. Additionally, due to the nature of software, functionsdescribed above can be implemented using software, hardware, firmware,hardwiring, or combinations of any of these. The use of the term “a”herein and throughout the application is not used in a limiting mannerand therefore is not meant to exclude a multiple meaning or a “one ormore” meaning for the term “a.” Additionally, to the extent priority isclaimed to a provisional patent application, it should be understoodthat the provisional patent application is not limiting but includesexamples of how the techniques described herein may be implemented.

A number of embodiments have been described. Nevertheless, it will beunderstood that various modifications may be made without departing fromthe spirit and scope of the claims and the examples of the techniquesdescribed herein.

1.-12. (canceled)
 13. A method of manufacturing a transducer comprising:fabricating a first piezoelectric layer; and fabricating a secondpiezoelectric layer that is above the first piezoelectric layer; whereinthe first piezoelectric layer has a non-uniform amount of residualstress that becomes more tensile as a thickness of the firstpiezoelectric layer increases, and the second piezoelectric layer has anaverage residual stress that is more compressive than an averageresidual stress of the first piezoelectric layer, or wherein the firstpiezoelectric layer has a non-uniform amount of residual stress thatbecomes more compressive as the thickness of the first piezoelectriclayer increases, and the second piezoelectric layer has an averageresidual stress that is more tensile than an average residual stress ofthe first piezoelectric layer.
 14. The method of claim 13, wherein beingmore compressive corresponds to a downward deflection in the secondpiezoelectric layer and wherein being more tensile corresponds to anupwards deflection in the second piezoelectric layer.
 15. The method ofclaim 13, wherein the second piezoelectric layer is a more compressivelayer with an average residual stress that is less than or morecompressive than the average residual stress of the first piezoelectriclayer.
 16. The method of claim 13, wherein the second piezoelectriclayer is a more tensile layer with an average residual stress that isgreater than or less compressive than the average residual stress of thefirst piezoelectric layer.
 17. The method of claim 13, wherein avertical stress of the second piezoelectric layer offsets a verticalstress of the first piezoelectric layer to reduce deflection in thetransducer.
 18. The method of claim 13, wherein the transducer comprisesa MEMS transducer, an acoustic transducer, a piezoelectric transducer ora microphone.
 19. The method of claim 13, further comprising:fabricating a third intervening layer between the first and secondpiezoelectric layers.
 20. The method of claim 19, wherein the thirdintervening layer comprises a layer of molybdenum.
 21. The method ofclaim 19, wherein the average residual stress of the secondpiezoelectric layer compensates for a residual stress imparted by thethird intervening layer.
 22. The method of claim 13, wherein the firstand second piezoelectric layers form a cantilever.
 23. The method ofclaim 13, wherein the first and second piezoelectric layers comprise asame material.
 24. The method of claim 13, wherein the firstpiezoelectric layer comprises a different material than the secondpiezoelectric layer.
 25. The method of claim 13, wherein at least one ofthe first piezoelectric layer or the second piezoelectric layercomprises aluminum nitride.
 26. The method of claim 13, wherein thesecond piezoelectric layer is fabricated by adjusting a bias power to alevel that produces the average residual stress that compensates for thenon-uniform amount of residual stress through the thickness of the firstpiezoelectric layer.
 27. The method of claim 26, wherein the secondpiezoelectric layer is fabricated using the level of the bias power isthroughout an entirety of fabrication of the second piezoelectric layer.28. The method of claim 13, wherein the second piezoelectric layer isfabricated by adjusting a gas flow rate to a level that produces theaverage residual stress that compensates for the non-uniform amount ofresidual stress through the thickness of the first piezoelectric layer.29. The method of claim 13, wherein the second piezoelectric layercomprises a non-uniform amount of vertical stress.
 30. The method ofclaim 13, wherein the first and second piezoelectric layers liesubstantially flat.
 31. The method of claim 30, wherein the first andsecond piezoelectric layers lying substantially flat comprise the firstand the second piezoelectric layers having less than a threshold amountof curvature or deflection.
 32. The method of claim 13, wherein theaverage residual stress of the second piezoelectric layer is morecompressive than the average residual stress of the first piezoelectriclayer.
 33. The method of claim 13, wherein the average residual stressof the second piezoelectric layer is more tensile than the averageresidual stress of the first piezoelectric layer.